
This proposal introduces a low-cost, thermally enhanced adhesive materialcombining graphite micro-flakes, copper microparticles, and a 3M-stylePressure Sensitive Adhesive (PSA) matrix.The hybrid aims to improve thermal spreading, mechanical compliance, andreliability in HBM stacks, interposers, DRAM slots, and PCB–socket bondingareas.The concept leverages:Conductive micro-fillers (Cu)High in-plane thermal conductivity (graphite flakes)Proven manufacturability of PSA filmsLower cost compared to silver or exotic filler systems
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