
The multi-layer PWB (printed wiring board) made of AFRP for laser drilling is chosen as a subject of our study. The drilling conditions of drilling the blind via holes and the quality of the drilled holes are examined using a CO2 laser source against this composite material. As a result, it is shown that there are the processing conditions which AFRP is drilled without drilling through the copper foil of the inner layer. Laser drilling is an effective method to perform the blind via holes. Additionally, it is feasible to drill the hole with promising tapers against plating for electric circuits using a laser source.
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