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A Novel 14 Nm Extended Body Finfet For Reduced Corner Effect, Self-Heating Effect, And Increased Drain Current

Authors: Cheng-Hsien Chang; Jyi-Tsong Lin; Po-Hsieh Lin; Hung-Pei Hsu; Chan-Hsiang Chang; Ming-Tsung Shih; Shih-Chuan Tseng; +1 Authors

A Novel 14 Nm Extended Body Finfet For Reduced Corner Effect, Self-Heating Effect, And Increased Drain Current

Abstract

{"references": ["D. Hisamoto,W.-C. Lee, J.Kedzierski,H. Takeuchi, K. Asano, C.Kuo, E.\nAnderson, T.-J. King, J.Bokor,and C. Hu, \"FinFET\u00d4\u00c7\u00f6A Self-Aligned\nDouble-Gate MOSFETScalable to 20 nm,\"IEEE Trans. Electron\nDevices, vol. 47, no. 12, pp. 2320-2325, Dec. 2000.", "X. Huang, W.-C. Lee,C.Kuo, D.Hisamoto, Member,L. Chang,\nJ.Kedzierski, E. Anderson, H. Takeuchi, Y.-K. Choi,K. Asano, V.\nSubramanian, T.-J. King, J.Bokor,and C. Hu,\"Sub-50 nm P-Channel\nFinFET,\" IEEE Trans. Electron Devices, vol. 48, no. 5, pp. 880-886,\nMay 2001.", "A. A. Orouji, and M. Mehrad,\"A New Rounded Edge Fin Field Effect\nTransistor for Improving Self-Heating Effects,\" Japanese Journal of\nApplied Physics, vol. 50 , pp. 124303-1-6, 2011.", "M.Mehrad and A. A. Orouji,\"Partially Cylindrical Fin Field-Effect\nTransistor:A Novel Device for Nanoscale Applications,\"IEEE Trans.\nElectron Devices and Materials Reliability, vol. 10, no.2, pp. 271-275,\nJune 2010.", "L. Mathew, M. Sadd, S. Kalpat, M. Zavala, T. Stephens, R. Mora, S.\nBagchi, C. Parker, J. Vasek, D. Sing, R. Shimer, L. Prabhu, G.O.\nWorkman, G. Ablen,Z.Shi, J.Saenz , B. Min, D. Burnett, B.-Y. Nguyen,\nJ. Mogab., M.M. Chowdhury, W. Zhang,J.G.\nFossum,\"Inverted T channel FET (ITFET)-\nFabrication andcharacteristics of vertical-horizontal, thin body,multigate,\nmulti-orientationdevices, ITFET SRAM bit-cell operation.A novel\ntechnology for 45nm and beyond CMOS,\" inIEDM Tech. Dig., pp. 713-\n716, 2005.", "X.Xu, R. Wang, R. Huang, J.Zhuge,G. Chen, X. Zhang,and Y.\nWang,\"High-Performance BOI FinFETs Basedon Bulk-Silicon\nSubstrate,\"IEEE Trans. Electron Devices, vol. 55, no. 11, pp. 3246-\n3250, Nov. 2008.", "M.Shrivastava,M. S.Baghini,D. K. Sharma, and V.\nR.Rao,\"A Novel Bottom Spacer FinFET StructureforImprovedShort-\nChannel, Power-Delay, and Thermal Performance,\"IEEE Trans.\nElectron Devices, vol. 57, no. 6, pp. 1287-1293, June 2010.", "X. Sun, V. Moroz, N.Damrongplasit,C. Shin, and T.-J. King Liu,\n\"Variation Study of the Planar Ground-Plane BulkMOSFET, SOI\nFinFET, and TrigateBulk MOSFET Designs,\"IEEE Trans. Electron\nDevices, vol. 58, no. 10, pp. 3294-3299, Oct. 2011.", "Y.-C.Eng, J.-T. Lin, C.-H.Kuo,P.-H. Lin, Y.-H. Fan, and H.-H.\nChen,\"Numerical Study of a Highly Scaled Bulk MOSFETWith Block\nOxide and Source/Drain-Tied Structure,\"IEEE Trans. Electron Devices,\nvol. 58, no.5, pp. 1381-1387, 2011.\n[10] User-s manual, ISE TCAD, 2004."]}

In this paper, we have proposed a novel FinFET with extended body under the poly gate, which is called EB-FinFET, and its characteristic is demonstrated by using three-dimensional (3-D) numerical simulation. We have analyzed and compared it with conventional FinFET. The extended body height dependence on the drain induced barrier lowering (DIBL) and subthreshold swing (S.S) have been also investigated. According to the 3-D numerical simulation, the proposed structure has a firm structure, an acceptable short channel effect (SCE), a reduced series resistance, an increased on state drain current (I on) and a large normalized I DS. Furthermore, the structure can also improve corner effect and reduce self-heating effect due to the extended body. Our results show that the EBFinFET is excellent for nanoscale device.

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Keywords

SOI, tri-gate, FinFET, self-heating effect.

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This indicator reflects the "current" impact/attention (the "hype") of an article in the research community at large, based on the underlying citation network.
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