In this work, a CO/sub 2/ laser-assisted silicon lid sealing process, utilizing Au80/Sn20 solder, for encapsulating gas breakdown test micro-electro-mechanical structures (MEMS) in a ceramic quad flatpack (CQFP) was studied. Wire bonded MEMS dies were sealed into CQFPs under various gas media, such as air, nitrogen, helium and vacuum. The gas breakdown test results showed a significantly higher breakdown voltage for vacuum packaged parts compared to those packaged in other various gas environments. Hermeticity testing according to MIL-STD-883E showed that the leak rate of the package was below 10/sup -8/ atm cc/s. The bonding was uniform and the bonding strength is believed to be comparable to the tensile strength of Au80/Sn20 solder.