Material transport within a semiconductor factory (fab) can be broken into two categories - interbay (bay to bay movement) and intrabay (within bay) movement. Due to the fragile properties of semiconductors, there are risks associated with any movement of material. These risks range from misprocessed or damaged wafers, to throughput loss. These risks are increased during manual intrabay handling, where several operations may be taking place in a populated, confined area. Intrabay automated material handling is a means by which the above-mentioned risks can be reduced or eliminated. Simulation can play a key role in the design of intrabay automation systems, in verifying that the system will not negatively affect throughput of an area. A simulation model has been developed to analyze the effects of intrabay AMHS on a manufacturing bay. Model architecture is discussed, and three case studies demonstrate applications of the model.