AbstractThe present study investigates the removal of copper ions (Cu (II)) from aqueous solution using chemically treated rice husk (TRH). The chemical treatment was carried out using NaOH solution and the effect of contact time (tc), adsorbent dosage (Dad), initial Cu (II) concentration ([Cu]i), and temperature (T) on the percentage removals of Cu (II) (%RCu) were investigated. Different analytical techniques (FTIR, SEM, and EDX) were used to confirm the adsorption (ads) of Cu (II) onto the TRH. The ads kinetics was tested against pseudo-first-order (PFO) and pseudo-second-order (PSO) models as well as Langmuir and Freundlich isotherms. Treating RH with NaOH altered the surface and functional groups, and on the surface of RH, the ionic ligands with high electro-attraction to Cu increased and thus improved the removal efficiency. The %RCu decreased by increasing the [Cu]i and increased by increasing the ct, Dad, and T. Up to 97% Cu removal was achieved in ct of 30 min using Dad of 0.3 g [Cu]i of 25 mg L−1 and T = 280 K. The ads of Cu on TRH is endothermic, spontaneous, follows Langmuir isotherms, and exhibited a PSO kinetics. Moreover, the TRH was successfully regenerated and used for further adsorption cycles using 1 M HNO3.