Powered by OpenAIRE graph
Found an issue? Give us feedback
image/svg+xml Jakob Voss, based on art designer at PLoS, modified by Wikipedia users Nina and Beao Closed Access logo, derived from PLoS Open Access logo. This version with transparent background. http://commons.wikimedia.org/wiki/File:Closed_Access_logo_transparent.svg Jakob Voss, based on art designer at PLoS, modified by Wikipedia users Nina and Beao IEEE Transactions on...arrow_drop_down
image/svg+xml Jakob Voss, based on art designer at PLoS, modified by Wikipedia users Nina and Beao Closed Access logo, derived from PLoS Open Access logo. This version with transparent background. http://commons.wikimedia.org/wiki/File:Closed_Access_logo_transparent.svg Jakob Voss, based on art designer at PLoS, modified by Wikipedia users Nina and Beao
IEEE Transactions on Components Hybrids and Manufacturing Technology
Article . 1980 . Peer-reviewed
License: IEEE Copyright
Data sources: Crossref
versions View all 1 versions
addClaim

This Research product is the result of merged Research products in OpenAIRE.

You have already added 0 works in your ORCID record related to the merged Research product.

A New Multifunctional Mass Termination Connector

Authors: A. Carlisle; D. Frey;

A New Multifunctional Mass Termination Connector

Abstract

A new modular connector system has been developed for the mass termination of intrabay and interbay wiring of electronic equipment such as in telephone central offices. Intended for semipermanent connections when only a few reconnects are anticipated, the connector can be used for splicing, bridging, and halftapping cable having 22-26 gauge solid copper conductors with a variety of insulations. The connector utilizes the slotted-beam insulation-piercing contact in a conceptually new fashion; the contact is designed for up to ten reinsertions on the same point of a wire with high reliability and long-term stability. To achieve the small size, high strength, and elasticity requirements of the contact element, a newly developed spinodal copper-nickel-tin alloy is used for the contact material. The design and performance of this new modular connector system are discussed. Also covered are the associated assembly tools, typical applications, and environmental testing of the connector.

Related Organizations
  • BIP!
    Impact byBIP!
    selected citations
    These citations are derived from selected sources.
    This is an alternative to the "Influence" indicator, which also reflects the overall/total impact of an article in the research community at large, based on the underlying citation network (diachronically).
    1
    popularity
    This indicator reflects the "current" impact/attention (the "hype") of an article in the research community at large, based on the underlying citation network.
    Average
    influence
    This indicator reflects the overall/total impact of an article in the research community at large, based on the underlying citation network (diachronically).
    Average
    impulse
    This indicator reflects the initial momentum of an article directly after its publication, based on the underlying citation network.
    Average
Powered by OpenAIRE graph
Found an issue? Give us feedback
selected citations
These citations are derived from selected sources.
This is an alternative to the "Influence" indicator, which also reflects the overall/total impact of an article in the research community at large, based on the underlying citation network (diachronically).
BIP!Citations provided by BIP!
popularity
This indicator reflects the "current" impact/attention (the "hype") of an article in the research community at large, based on the underlying citation network.
BIP!Popularity provided by BIP!
influence
This indicator reflects the overall/total impact of an article in the research community at large, based on the underlying citation network (diachronically).
BIP!Influence provided by BIP!
impulse
This indicator reflects the initial momentum of an article directly after its publication, based on the underlying citation network.
BIP!Impulse provided by BIP!
1
Average
Average
Average
Upload OA version
Are you the author of this publication? Upload your Open Access version to Zenodo!
It’s fast and easy, just two clicks!