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handle: 2117/10531
In this paper we present an electro-thermal coupling simulation technique for RF circuits. The proposed methodology takes advantage of well established tools for frequency translating circuits in order to significantly reduce the computational resources needed when frequencies of interest are separated by orders of magnitude.
Metal oxide semiconductors, Complementary, Electronic engineering, Electrònica, Radio frequency, :Enginyeria electrònica [Àrees temàtiques de la UPC], System-on-chip design and technologies, Àrees temàtiques de la UPC::Enginyeria electrònica
Metal oxide semiconductors, Complementary, Electronic engineering, Electrònica, Radio frequency, :Enginyeria electrònica [Àrees temàtiques de la UPC], System-on-chip design and technologies, Àrees temàtiques de la UPC::Enginyeria electrònica
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