Ti: sapphire femtosecond laser ablation of dielectrics (fused silica and BK7 glass) and metals (Cu, Fe, Al) is presented. Results of laser -induced breakdown experiments in fused silica and BK7 glass employing 130 fs -1.7 ps, 790 nm laser pulses are reported. The fluence ablation threshold does not follow the scaling of 4>th ~ ^/2 when pulses are shorter than 1 ps. Single-shot and multi-shot (130 fs pulse) ablation of selected materials are investigated with laser wavelengths of 395 nm, 790 nm, and 1300 nm. The ablation threshold is almost independent of the laser wavelength. The surface morphologies in metals after ultrashort pulse ablation are very different from dielectrics and semiconductors. The roughness of the ablated surface depends on the thermal properties of the metal target. The preliminary TEM result from Cu single crystal that was irradiated by single laser pulses shows few defects in the center region of the ablated crater. Single-shot ablation of single-crystal Fe induces much different surface features than on selected samples of poly-crystal Fe metal.

Master of Engineering (ME)

Thesis