
handle: 10902/33534
Throughout the project, I utilized SolidWorks Software to design, assemble, and simulate a heat sink for a heat sink company with a computer science background that needs it to be used on a silicon computer chip. The primary objective was to design a heat sink that could lower the temperature of the silicon chip to less than 43.5ºC. Afterwards, this report had to be created in order to explain the client the design as well as the simulation results.
Grado en Ingeniería Mecánica
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