Chemical Mechanical Polishing (CMP) is used in semiconductor industry to enable planarization of the interlayer dielectrics and metals. In this study, CMP is used as a polishing technique to modify the surface roughness of the bio-implant materials in a controlled manner. As an alternative technique to sand-blasting/etching or laser structuring on the implant surfaces, CMP results in formation of a protective oxide layer on the titanium surfaces that can limit surface contamination while enabling surface nano-structuring that is known to promote bioactivity. Keywords: CMP, Titanium Implants, Biomaterials, Micro-Patterning.

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http://ieeexplore.ieee.org/xpls/abs_all.jsp?arnumber=6353813&tag=1