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Mechanics of thin film adhesion

descriptionPublicationkeyboard_double_arrow_right Thesis 17 Sep 2008 Singapore
Authors: Duan, Jin.;

handle: 10356/5686

Mechanics of thin film adhesion

Abstract

The aim of this work was to refine the understanding and application of the flat-rectangular-punch (Model I) and axisymmetric-flat-punch (Model II) adhesion test, which were modified and reinforced V-peel and shaft-loaded blister test, respectively.

Master of Engineering (MPE)

Country
Singapore
Related Organizations
Keywords

DRNTU::Engineering::Materials::Microelectronics and semiconductor materials::Thin films, 620

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selected citations
These citations are derived from selected sources.
This is an alternative to the "Influence" indicator, which also reflects the overall/total impact of an article in the research community at large, based on the underlying citation network (diachronically).
BIP!Citations provided by BIP!
popularity
This indicator reflects the "current" impact/attention (the "hype") of an article in the research community at large, based on the underlying citation network.
BIP!Popularity provided by BIP!
influence
This indicator reflects the overall/total impact of an article in the research community at large, based on the underlying citation network (diachronically).
BIP!Influence provided by BIP!
impulse
This indicator reflects the initial momentum of an article directly after its publication, based on the underlying citation network.
BIP!Impulse provided by BIP!
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