
handle: 10356/2556
In this project, a dual-band BPF for the concurrent dual-band wireless transceiver was developed. The dual-band BPF was implemented using ceramic material to obtain a low insertion loss performance. In order to minimize the device area, the dual-band BPF was place on the top of the IC package. In this case, the filter was implemented using a transmission line rather than a lumped element to minimize losses.
Master of Philosophy
DRNTU::Engineering::Electrical and electronic engineering::Wireless communication systems
DRNTU::Engineering::Electrical and electronic engineering::Wireless communication systems
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