
handle: 10356/19554
Process optimization on wave soldering machines in the IVP CA lines yields higher productivity and better quality. This report describes the results of optimizing four control factors on the wave soldering machine to achieve reduced solderability defective rate using the Taguchi technique of experimental design and the Response Surface Methodology (RSM). The four control factors explored were Solder Pot Temperature, Conveyor Speed, Preheat Temperature and Solder Pot Height. Master of Science (Consumer Electronics)
570, :Engineering::Electrical and electronic engineering::Electronic apparatus and materials [DRNTU], 600, DRNTU::Engineering::Electrical and electronic engineering::Electronic apparatus and materials
570, :Engineering::Electrical and electronic engineering::Electronic apparatus and materials [DRNTU], 600, DRNTU::Engineering::Electrical and electronic engineering::Electronic apparatus and materials
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