AbstractThis paper studies the cleaning of commercial copper with two new aqueous alkaline solutions containing formaldehyde and D(+)glucose at room temperature. The results are compared with a conventional cleaning solution. Three organic corrosion inhibitors were used: Phloroglucinol, 8‐Quinolinol and Resorcinol. Rest potential, polarization resistance and polarization curves were the electrochemical techniques used. The gravimetric technique was also used. It has been observed that the two new cleaning solutions remove copper tarnishing. The solution with D(+)glucose produces the best surface finish. Likewise, the conventional solution is an excellent copper cleaning bath. The order of inhibition efficiency of the organic inhibitors is as follows: 8‐Quinolinol > Phloroglucionol > Resorcinol.