Most high-fidelity digital cameras currently available obtain their images using technology where individual pixels can only acquire a single color. Since the acquisition of multiple colors is necessary to capture a full colored image, picture resolution is lost due to difficulties in interpolation between non-adjacent, same color pixels. The resulting unsharp images create the need to find a new way to obtain these images without requiring interpolation between adjacent pixels. An innovative method to capture images with individual pixel cells consisting of three layers of photodetectors stacked vertically upon one another has been created to rectify this problem, but no complete camera system has been fabricated to date. This project integrates a stacked photo detector imager chip into a complete camera, allowing full functionality and control of the photo detector chip to a personal computer. A six layer printed circuit board is fabricated using Cadence Allegro, firmware is written and compiled using Xilinx ISE and software is written in Microsoft Visual Studio 2010.