Polyetheretherketone (PEEK) is a very powerful biomaterial that is increasingly used in dentistry. It has superior properties, which make it desirable in implantology. The applications of PEEK include finger prosthesis, RPD and FPD framework, and dental implants. Changes in the production of polyketone-based materials have been made to ensure consistent production of polymers for medical applications. PEEK is a high-performance semicrystalline material that has physical properties such as high resilience and strength. It is a tooth-colored material, making it desirable for its aesthetic appearance. Traditional manufacturing methods like injection molding, extrusion, and compression molding are used for PEEK. Despite the high price of the polymer, the additional value that PEEK materials bring by offering the possibility of manufacturing parts include lightweight, strength or toughness and able to survive longer in harsh environments. PEEK has trauma or shock cancelling abilities, fracture resisting abilities, stress distributing ability, osseointegrating abilities, With such great qualities PEEK has an increased demand in the market, and this biomaterial never failes to surprise with its amazing success rate. Even in dentistry PEEK has a wide range of applications which includes, as a dental implants biomaterial, prosthetic material, abutment material, post and core material, crowns, removable partial denture framework. With such a huge range of applications PEEK is said to have been providing an all in one package for dentistry. PEEK biomaterial shows great compatibility with bioactive materials which has proven to be of great help to mankind as not only it is involved in life sciences but also in automotives and aerodynamics as well. The main motto of this review is to know the qualities and the properties of PEEK as a capable implant prosthesis for its application focusing on dental implants. This review tells us about the challenges faced when using this material and benefits and advantages of this biomaterial.