Electrodes with submicron gaps are desired for achieving high amplication redoxcycling sensors. In this contribution we report the use of electrodeposition of gold in order todecrease the inter-electrode spacing at interdigitated electrodes. Using this method submicronspacings can be obtained without expensive techniques such as e-beam lithography or focusedion beam milling. Initially, gold interdigitated electrodes with a nger spacing of 2.5 m wererealized by lift-o processing. Using a commercial gold sulphite bath (ECF64D) and 100 mscurrent pulses of -1.78 A, these gold electrodes were plated with an additional gold layer. Asa result, the inter- electrode spacing, as measured using atomic force microscopy and conven-tional microscopy, was reduced to 0.6 m. The achieved gap spacing is limited by electrodeimperfections resulting from the lift-o process. At these imperfections the electrodes becomeshorted. Additional experiments with wet etched electrodes are expected to yield smaller gapspacings