ABSTRACT This webinar is based on the solder reflow fundamentals class and reflow section of the Jump Start Program that has been presented at SMTAI in Rosemont, IL. It is designed for the new SMT engineers/technicians or current engineers that want a better understanding of the reflow process. It discusses recipes vs. profiles, heat transfer in a reflow oven, oven control, why profiles are shaped the way they are, and how to obtain profiles. Additional topics of discussion include TC accuracy and mounting, profilers, test vehicles, and process windows. About the Presenter: Fred Dimock is the Manager of Process Technology at BTU International in North Billerica Massachusetts. He holds an Associate Degree in Mechanical Design from Wentworth in Boston and a Bachelors Degree in Ceramic Engineering from the State University of New York (SUNY) at Alfred. Fred has authored numerous articles on lead free solder, process control, and the operation of continuous furnaces. His papers have been published in English, Chinese, and German. He received “Best Vendor Presentation” award at the East China SMTA conferences in 2011 and 2012. He has taught numerous SMTA solder reflow classes and participated in the 5-45 Subcommittee for the development of IPC-7801 Reflow Oven Process Control Standard. Additionally he wrote the chapter on solder reflow for the Handbook of Electronic Assembly and A Guide to SMTA Certification by Dr Lasky and Jim Hall. He received Distinguished Speaker status at SMTA Guadalajara Mexico and is a key presenter for the SMTA Jump Start program for new engineers. Recorded Presentation (On Demand)