ABSTRACT We all know that the paste print process is the most unstable element in the SMT line. Arguably, this process contributes to 50-70% of the total defects seen during an SMT build. The reason for this large variation is due to the number of process parameters involved. It is generally accepted that there are about 35 variables to be controlled. Logically, if we could control this process through some form of inspection, then the defects seen at the end of the line could be greatly reduced. Using AOI to inspect Solder Paste is becoming more and more accepted by the Electronics Manufacturing Industry, however, what is the best approach to inspecting Solder Paste? Inspection incorporated into the screen printer itself using 2D or 3D options? Inspecting 2D or 3D after the printer with a stand-alone AOI system? Inspecting paste after the high-speed placement? Which is the better option: 2D systems or 3D systems? Are combination 2D/3D approaches better? This paper explores the different possibilities and comes up with some new and unique solutions.