
In this study, the operation method of the proposed ferroelectric memory structure as a method to overcome the limitations of the existing Charge Trap Flash (CTF) memory Vertical NAND (V-NAND) structure was presented and verified through device simulation. The proposed structure and operation method applied the BiCS (Bit Cost Scalable) structure GIDL (Gate Induce Drain Leakage) deletion method to confirm that selective program operation is possible in the ferroelectric memory V-NAND (Vertical Channel NAND) structure. In particular, we confirmed that the proposed method can easily suppress the program operation by adjusting the hole density of the channel even in the “Y-mode” operation. The channel hole density adjustment that makes this possible can be easily controlled by the voltage difference between the bit line (BL) and drain select line (DSL) contacts. The proposed structure was verified through a device simulation, and as a result of the verification, it was confirmed that the channel hole can be selectively charged in the program operation. Through this, when the cell to be programmed shows the program operation of 2.3 V, the other cells do not. It was confirmed that it could be suppressed to 0.4 V.
GIDL, ferroelectric memory, polysilicon, vertical channel NAND flash
GIDL, ferroelectric memory, polysilicon, vertical channel NAND flash
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