A nondestructive method for measuring multilayered plating thickness has been developed utilizing intensity measurements made with an x-ray fluorescence spectrometer. A series of multilayered platings was fabricated, and the thickness of each was determined through the use of a Link gage block interferometer. These samples were used in experiments to determine the absorption and enhancement effects that are present when an x-ray fluorescence spectrometer is used to measure the thickness of a multilayered plating. The results of the investigation indicated that enhancement corrections must be applied to x-ray measurements of gold thickness up to 20 microinches (508 nm). The effect of absorption of the rhodium K-Alpha line in the gold layer was found to have an insignificant effect on the measurement of rhodium thickness; corrections are not needed. Present technology results in an ability to detect a 1-microinch (25.4 nm) change in gold thickness with an estimated calibration uncertainty (bias) of +-4 microinches (+-101.6 nm). The thickness of the rhodium underplate can be determined with an estimated uncertainty of +-10 microinches (254 nm). Additional work is being performed to establish confidence in the plating-thickness measurement method that has been developed.