Mechanical properties of polystyrene bead encapsulation foam
Mechanical properties of polystyrene bead encapsulation foam
The tensile and compressive properties of polystyrene bead foam used as an encapsulant for electronic devices were determined for densities ranging from 0.3 to 0.6 g/cm/sup 3/. Data were generated for these properties at -54, 25, and 74/sup 0/C. Data previously reported for 0.2 g/cm/sup 3/ are included.
- University of North Texas United States
Organic Polymers, Organic Compounds, Polymers, 36 Materials Science, Electronic Equipment, Compression, Density, Foams, Polyvinyls 360403* -- Materials-- Polymers & Plastics-- Mechanical Properties-- (-1987), Petroleum Products, Polyolefins, Physical Properties, Petrochemicals, Mechanical Properties, Encapsulation, Colloids, Dispersions, Polystyrene, Plastics
Organic Polymers, Organic Compounds, Polymers, 36 Materials Science, Electronic Equipment, Compression, Density, Foams, Polyvinyls 360403* -- Materials-- Polymers & Plastics-- Mechanical Properties-- (-1987), Petroleum Products, Polyolefins, Physical Properties, Petrochemicals, Mechanical Properties, Encapsulation, Colloids, Dispersions, Polystyrene, Plastics
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