
doi: 10.2172/4833802
Presented at Regional Technical Conference on Plastic Foams, Society of Plastics Engineers, Buffalo, New York, October 1961. A method of protecting modular electronic subassemblies against mechanical shock up to several thousand G is described. The components are supported with urethane foam spacers which are either machined or molded to fit the component external contour. (J.R.D.)
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