Electromechanical film (EMFi)-based air-coupled ultrasonic transducers are recognized for their significant potential in non-destructive testing (NDT) applications, primarily due to their large piezoelectric sensitivity and ultra-low acoustic impedance. However, challenges such as high electrical impedance and phase misalignment, have significantly limited their practical application. In this work, the five-layer co-extruded cellular polypropylene (cPP) with an acoustic impedance of 0.029 MRayls were utilized for the EMFi-based air-coupled ultrasonic transducers (EAUT). To address electrical impedance issues, we employed an electrical matching optimization method using the Smith chart and Butterworth-Van Dyke (BVD) model. Specifically, a series inductor of 921 μH was integrated into the electrical matching circuit. Consequently, the matched EAUT demonstrates a signal intensity exceeding that of the non-matched configuration by more than 100 times. Ultimately, the ultrasound imaging capabilities of the matched EAUT underscore its substantial potential for practical applications.