Mixed Mode Fracture in Electronic Packages

descriptionPublicationkeyboard_double_arrow_right Article 01 Jan 1996 English Publisher:Springer Science and Business Media LLCJournal:MRS Proceedings, volume 445 (issn: 0272-9172, eissn: 1946-4274,

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Authors: W. O. Soboyejo; V. Sinha; V. Kenner;

doi: 10.1557/proc-445-263

Mixed Mode Fracture in Electronic Packages

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Abstract

AbstractIn this paper, mixedmode (mode I + mode II) fracture toughness data are presented for the prediction of molding compound (silica filled epoxy resin) failure. The stresses necessary to cause the package cracking under mixed mode loading are experimentally determined. Measured toughness values are presented as a function of modemixity and temperature

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