The article presents the results of the study of polymerization processes of industrial adhesives, suitable for the assembly of electro-mechanical devices. According to [1, 2] were chosen for the study 14 samples of adhesives: Epotecny E505, Epotecny P102, Epotecny E207, EPO-TEK H74UNF, EPO-TEK H77S, EPO-TEK 353ND, Resbond 940LE, Resbond 989F, Cerambond 618N, ВК-21, Аnaterm 106, К400, ОС-52, ОС-92. For all samples of adhesives by differential thermal analysis is used to study parameters such as temperature mass loss, the number of stages and the temperature of polymerization, the temperature of the beginning of destruction in a predetermined tem-perature range. Presents the results of comparing the values of temperature of the beginning of destruction of adhesives, as claimed by the manufacturer and obtained experimentally. The paper identified the most important features of the process of polymerization of the adhesive samples. Investigated the rea-sons for the formation of internal stresses during polymerization of the adhesive joints in electro-mechanical devices and develop appropriate measures to reduce these stresses. On the basis of the results of differential thermal analysis of polymerization adhesives proposed effective modes of drying ad-hesives to improve the adhesive joints. An experimental study of the adhesive joints obtained by the proposed mode of drying and recommended by the manufacturer.