Thermal testing: fault location strategies

descriptionPublicationkeyboard_double_arrow_right Article , Conference object 07 Nov 2002Publisher:IEEE Comput. SocJournal:Proceedings 18th IEEE VLSI Test Symposium

Authors: Josep Altet; Antonio Rubio 0001; Emmanuel Schaub; Stefan Dilhaire; Wilfrid Claeys;

doi: 10.1109/vtest.2000.843844

Thermal testing: fault location strategies

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Abstract

By measuring the temperature at some points of an IC during a test procedure, defects can be detected (fault testing). With a simple processing of the measured temperature waveform, the distance between the temperature monitoring point and the activated defect can be derived. This paper presents four temperature measuring strategies to determine this distance for diagnosis purposes.

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University of Bordeaux
France

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