
A built-in self-test technique for MEMS that is applicable to symmetrical microstructures is described. A combination of existing layout features and additional circuitry is used to make measurements from symmetrically-located points. In addition to the normal sense output, self-test outputs are used to detect the presence of layout asymmetry that are caused by local, hard-to-detect defects. Simulation results for an accelerometer reveal that our self-test approach is able to distinguish misbehavior resulting from local defects and manufacturing process variations.
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