Deep reactive ion etching (DRIE) has virtually changed MEMS. The basic technology originally developed at Bosch overcomes design restrictions and compatibility problems related to the old wet-etching technology. Today, after a decade of "Bosch DRIE" in the field, a large variety of new MEMS devices is fabricated using this technology, and a broad DRIE-equipment supplier base is supporting costumer needs all over the world. The paper is telling the milestones from early development of the basic technology, the first steps into the MEMS-field, the way to mass-production, the first high-volume products, and the development of advanced solutions for high-rate etching, enhanced profile and uniformity control, and suppression of notching.