Mechanical testing of thin films

R.P. Vinci; J.C. Bravman

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https://doi.org/10.1109/sensor...

Article . 2002 . Peer-reviewed

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https://dx.doi.org/10.1109/sen...

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Mechanical testing of thin films

descriptionPublicationkeyboard_double_arrow_right Article , Other literature type 09 Dec 2002Publisher:IEEEJournal:TRANSDUCERS '91: 1991 International Conference on Solid-State Sensors and Actuators. Digest of Technical Papers

Authors: R.P. Vinci; J.C. Bravman;

doi: 10.1109/sensor.1991.149045

Mechanical testing of thin films

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Abstract

The authors briefly discuss standard testing methods for thin films and compare them with a number of newer techniques. Basic material considerations in thin film stresses and deformation are summarized. Finally, microcantilever beam bending and wafer curvature experiments are presented as representative of recent work in mechanical testing of thin films. >

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Stanford University
United States

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