
This paper gives a comparison the IBM main frame packaging technology and hardware system structure for the last three CMOS generations (z900, z990 and z9) and presents an outlook on the key challenges for the future. The chip and packaging technologies have enabled a node like structure which resulted in a modular concept supporting the IBM On Demand Business Concept. The key challenges for the high-end servers which are the continuously increasing data bandwidth and the increasing node power are discussed
| selected citations These citations are derived from selected sources. This is an alternative to the "Influence" indicator, which also reflects the overall/total impact of an article in the research community at large, based on the underlying citation network (diachronically). | 2 | |
| popularity This indicator reflects the "current" impact/attention (the "hype") of an article in the research community at large, based on the underlying citation network. | Average | |
| influence This indicator reflects the overall/total impact of an article in the research community at large, based on the underlying citation network (diachronically). | Average | |
| impulse This indicator reflects the initial momentum of an article directly after its publication, based on the underlying citation network. | Average |
