With the rapid development of the semiconductor filed, more and more challenges have been put forward to the packaging materials as well. Epoxy molding compound (EMC) as one the most important packaging material with the monopoly position was required for low water absorption, high adhesion, and low internal stress and so on. Here, adhesion improvement has been investigated through introducing special sulfur-containing compound Tris-[(3-mercaptopropionyloxy)-ethyl]-isocyanurate(TEMPIC), Pentaerythritol tetrakis (3-mercaptopropionate)(PEMP), 3, 3'-Thiodipropionic acid(TDPA), and YSLV-120TE. At the same time, the properties of EMC modified by above additives such as Gel time, spiral flow, hot hardness(HH) Dynamic thermo mechanical analysis (DMA), pressure cooking test 24h (PCT), and adhesion test as well as flame retardance of UL-94 have been measured. And the results showed that YSLV-120TE displayed the lowest water absorption, and followed were TEPMIC and PEMP, while EMC with TDPA in was the one disclosed highest PCT24h data. All the EMC specimens with sulfur-containing compound mentioned above in exhibited lower modulus from DMA at higher temperature and lower HH compared to control. Furthermore, PEMP shorten gel time of EMC while TDPA and YSLV-120TE prolonged gel time of EMC. At last, the tested compound TEMPIC, PEMP, TDPA and YSLV-120TE all increased the adhesion of EMC on silver and NiPaAu(PPF), and EMC with TDPA in showed highest adhesion test data both on silver and PPF.