Logi-thermal analysis of digital circuits using mixed-signal simulator Questa ADMS

descriptionPublicationkeyboard_double_arrow_right Article , Conference object 01 Sep 2013Publisher:IEEEJournal:East-West Design & Test Symposium (EWDTS 2013)

Authors: Konstantin O. Petrosyants; Nikita I. Rjabov;

doi: 10.1109/ewdts.2013.6673151

Logi-thermal analysis of digital circuits using mixed-signal simulator Questa ADMS

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Abstract

CAD sybsystem for logi-thermal analysis of the digital circuits is presented. Logical circuits are described by VHDL language. Thermal regimes are calculated by electro-thermal analogy method. For the calculation of the thermal resistances and capacitances the thermal 3D simulator Overheat-IC based on semi-analytical solution of three-dimensional heat conduction equation is used. For simultaneous calculation of logical and thermal characteristics of IC analog and mixed-signal simulator Questa ADMS is used.

Related Organizations

Moscow State Institute of Electronics and Mathematics
Russian Federation
University of Technology
Russian Federation

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