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The application of e beam inspection on 3D NAND flash

descriptionPublicationkeyboard_double_arrow_right Article , Other literature type 01 Sep 2012Publisher:IEEEJournal:2012 e-Manufacturing & Design Collaboration Symposium (eMDC)
Authors: Hsiang-Chou Liao; Yi-Chin Chen; Guan-Ru Lee; Yen-Hao Shih; Hang-Ting Lue; Tuung Luoh; Ling-Wu Yang; +5 Authors

doi: 10.1109/emdc.2012.6338433

The application of e beam inspection on 3D NAND flash

Abstract

Various three-dimensional (3D) multilayer stacks NAND flash architectures are developed by several companies, the defect performance monitoring under such complicated architectures has become a new challenge in 3D NAND flash. The aim of this paper is to illustrate e beam inspection system can monitor the tiny, invisible defects and electrical defects that can not be recognized by optical systems.

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selected citations
These citations are derived from selected sources.
This is an alternative to the "Influence" indicator, which also reflects the overall/total impact of an article in the research community at large, based on the underlying citation network (diachronically).
BIP!Citations provided by BIP!
popularity
This indicator reflects the "current" impact/attention (the "hype") of an article in the research community at large, based on the underlying citation network.
BIP!Popularity provided by BIP!
influence
This indicator reflects the overall/total impact of an article in the research community at large, based on the underlying citation network (diachronically).
BIP!Influence provided by BIP!
impulse
This indicator reflects the initial momentum of an article directly after its publication, based on the underlying citation network.
BIP!Impulse provided by BIP!
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