Flexible multielectrode arrays (MEAs) are being developed with various materials, and polyimide has been widely used due to the conveniece of process. Polyimide is developed in the form of photoresist. And this enable precise and reproducible fabrication. PDMS is another good candidate for MEA base material, but it has poor surface energy and etching property. In this paper, we proposed a better fabrication process that could modify PDMS surface for a long time and open the site of electrode and pad efficiently without PDMS etching.