Void formation during reflow soldering

descriptionPublicationkeyboard_double_arrow_right Article 01 May 2012Publisher:IEEEJournal:2012 IEEE 62nd Electronic Components and Technology Conference

Authors: Thomas D. Ewald; Norbert Holle; Klaus-Jurgen Wolter;

doi: 10.1109/ectc.2012.6249064

Void formation during reflow soldering

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Abstract

In the present study the interaction between solder paste and the PCB surface finish and its impact on void formation was investigated. Therefore, a comprehensive set of tests was performed on test vehicles with different diameter of the solder powder, solder alloy composition, PCB surface finish and flux chemistry. Based on these experimental results a hypothesis of void generating mechanisms is presented characterizing the wetting process.

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