Comparison of a Cu UBM versus a Co UBM for Sn Flip-Chip Bumps

descriptionPublicationkeyboard_double_arrow_right Article 27 Jul 2005Publisher:IEEEJournal:Proceedings Electronic Components and Technology, 2005. ECTC '05., volume 2, pages 449-451

Authors: R. Labie; P. Ratchev; E. Beyne;

doi: 10.1109/ectc.2005.1441303

Comparison of a Cu UBM versus a Co UBM for Sn Flip-Chip Bumps

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Abstract

In this paper, pure Sn bumps are considered as Pb-free solder alternative. The thermal-cycling reliability of Sn is investigated for two different UBM materials: Cu and Co. A lifetime improvement of 40% is found for the Co-system. This can be explained by a change in failure mechanism: while Cu-Sn samples show a mixed failure mechanism of ductile shear through solder and brittle fracture at the intermetallic interface, the Co-Sn samples are characterized by dominant solder fatigue.

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