Reliability of flip chip BGA package on organic substrate

descriptionPublicationkeyboard_double_arrow_right Article 07 Nov 2002Publisher:IEEEJournal:2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070)

Authors: null Eun-Chul Ahn; null Tae-Je Cho; null Jong-Bo Shin; null Ho-Joong Moon; null Ju-Hyun Lyu; null Ki-Won Choi; null Sa-Yoon Kang; +1 Authors

doi: 10.1109/ectc.2000.853328

Reliability of flip chip BGA package on organic substrate

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Abstract

In this paper various reliability issues of the flip chip package on organic substrate, such as the 1st level bump joint reliability, die cracking, underfill cracking, and 2nd level solder ball joint reliabilty, are primarily described. This paper discusses the reasons and resolutions of failures.

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Samsung
Korea (Republic of)
Samsung (South Korea)
Korea (Republic of)

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