Rapid implementation of an MCM provides the most timely and efficient way of validating a circuit design concept in a few weeks. It uses MCM-CF technology, the diffusion patterning multilayer thick film technology, to support early prototyping efforts for demonstrating design validity. It is a versatile MCM technology spectrum which uses all the benefits of the conventional multilayer thick film experiences. It utilizes new DuPont material to help achieve fine features and higher circuit density surpassing both high temperature cofired and multilayer thick film density and feature sizes. This approach does not require expensive tooling, or long lead time for manufacturing, compared to similar cofired-custom MCM-C packages. One of the parameters of this approach is to have a predetermined package form factor that helps secure these substrates, prior to a circuit implementation to MCM. This technology lends itself to the most advanced MCM packaging styles, such as Land Grid Arrays (LGA) and Ball Grid Arrays (BGA) in an integral packaging rendition.