Flexible, quick turn around and high density interconnection circuit patterning capabilities are key for packaging manufacturing as the industry grows at an increasingly competitive and faster pace. A novel fabrication technology for multilayer ceramic (MLC) packaging has been investigated and developed to meet these challenges. This flexible technology combines the data-driven high energy, high current electron beam technology with the unique integrated-mask (for thick film) metallization process technology to enable converting the circuit design data to fully metalized ceramic sheets in minutes. Thus, many different designs can be patterned and ready for stacking/lamination in days (i.e. no new punch heads or metallization masks needed). In addition, this technology will significantly reduce product development cycle time when utilized for product design verification and prototype build, significantly. This paper describes the novel packaging manufacturing technology and experimental results. >