Fabrication of fabric LED array

descriptionPublicationkeyboard_double_arrow_right Article 01 Apr 2015Publisher:IEEEJournal:2015 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP)

Authors: Seiichi Takamatsu; Takahiro Yamashita; Toshihiro Itoh;

doi: 10.1109/dtip.2015.7161016

Fabrication of fabric LED array

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Abstract

We have developed mechanically soft and conformable light emitting diode (LED)-implemented fabric for the applications to the three dimensionally complicated shapes of furniture, tents and ceilings by transforming the shape of the lighting fabric. The developed LED fabric is assembled by the process in which the LED-mounted 5 × 20 mm pieces of printed circuit board (PCB) is firstly soldered to 2 cm wide ribbon with copper power lines and the resultant ribbons are secondly woven as wefts by using a 1.2 m wide automatic looming machine.

Related Organizations

National Institute of Advanced Industrial Science and Technology
Japan

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