
arXiv: 0805.0860
A novel way of filling high aspect ratio vertical interconnection (microvias) with an aspect ratio of >2:1 is presented. High frequency acoustic streaming at megasonic frequencies enables the decrease of the Nernst-diffusion layer down to the sub-micron range, allowing thereby conformal electrodeposition in deep grooves. Higher throughput and better control over the deposition properties are possible for the manufacturing of interconnections and metal-based MEMS.
Submitted on behalf of EDA Publishing Association (http://irevues.inist.fr/handle/2042/16838)
[INFO.INFO-OH] Computer Science [cs]/Other [cs.OH], FOS: Computer and information sciences, Computer Science - Other Computer Science, Other Computer Science (cs.OH)
[INFO.INFO-OH] Computer Science [cs]/Other [cs.OH], FOS: Computer and information sciences, Computer Science - Other Computer Science, Other Computer Science (cs.OH)
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