With the rapid development of semiconductor packages, the reliability requirement of the epoxy molding compound as the packaging material becomes more and more rigorous. Introducing adhesion prompter is one of the key methods to increase the reliability of epoxy molding compound, and silane coupling agent with different functional group was one of the most common choice of researchers. Compared to common silane, silane oligomer was partially hydrolyzed and contain more condensed functional groups, it might be a good promising candidate of adhesion promoter. Here, we tried silane oligomer as adhesion promoter to replace the silane in epoxy molding compound, and the properties of resulting epoxy molding compound with silane oligomers in have been tested. The results showed that compared to normal silane, silane oligomer accelerated the reaction speed of epoxy molding compound and the gel time (GT) and spiral flow (SF) all were shorten with the silane oligomer in. Epoxy molding compound with mercapto group silane oligomer A and amino group silane oligomer B all disclosed similar water absorption compared to that with normal silane in, while epoxy molding compound with epoxy group silane oligomer C in exhibited about 25% higher than that with normal silane in. Adhesion test revealed that epoxy molding compound with silane oligomer in all possessed higher adhesion on NiPaAu (PPF) leadframes with the value above 100 N after MSL3 test.