Successful use of solder joints to attach surface mounted devices to printed wiring board substrates requires knowledge of the stress‐strain properties of solder as functions of temperature, time, and loading conditions. In addition, the relatively high operating temperature of solder in comparison to its absolute melting temperature introduces a requirement for an understanding of the influence of creep effects on the mechanical properties of solder under cyclical loading conditions. In the past, studies of these solder properties have been limited by the need to use relatively large bulk solder samples that may or may not be representative of actual solder joints in a printed wiring board‐chip carrier environment. A previously unreported test method for the evaluation of the dynamic mechanical properties of solder and solder joints has been developed. The method is based upon the use of a Rheometrics Dynamic Spectrometer, which has been shown to be capable of determining both the elastic and plastic responses of solder joints during cyclical loading under a variety of imposed strains, strain rates, and temperatures that are within the range of anticipated service conditions. In addition, stress relaxation properties of solder joints may be studied.