Table of ContentsI. BROAD OVERVIEW: .................................................................................................................................. 3A ROADMAP FOR LOW POWER COMPUTING: MATERIALS FOR A SUSTAINABLE MICROELECTRONICS FUTURE .......... 3ENERGY EFFICIENT ELECTRONICS – RESEARCH NEEDS AND OUTLOOK ..................................................................... 8LOW-POWER HIGH-PERFORMANCE ELECTRONICS ................................................................................................... 12MAGNETOELECTRIC DEVICES TOWARDS LOW-ENERGY LOGIC ............................................................................... 18NEUROMORPHIC ENGINEERING –– BIO-INSPIRED AND BIO-MIMICKING COMPUTING PLATFORMS .................. 26COMPUTING-IN-MEMORY DESIGN AND BENCHMARK .............................................................................................. 29II. TECHNOLOGY APPROACHES ............................................................................................................... 34PATHWAYS TO VOLTAGE-CONTROLLED ANTIFERROMAGNETIC SPINTRONICS ........................................................... 34THE CHALLENGES AND OPPORTUNITIES OF MAGNETO-ELECTRIC MATERIALS AND DEVICES IN MESO TECHNOLOGY................................................................................................................................................................................. 39MAGNETOELECTRIC MEMORY DEVICES .................................................................................................................. 44FERROELECTRIC DEVICES FOR LOW POWER ELECTRONICS ....................................................................................... 50COMPUTATIONAL MODELING OF FERROELECTRICS: MATERIALS, DEVICES, AND CIRCUITS ....................................... 55COLD-SOURCE FET .................................................................................................................................................. 60COMPUTING WITH P-BITS ........................................................................................................................................ 64NEW STRUCTURES AND MATERIALS FOR SPINTRONICS COMPUTING ....................................................................... 68III. PROCESSING AND METROLOGY ........................................................................................................ 71PROCESS AND INTEGRATION CHALLENGES FOR LOW POWER ELECTRONICS .............................................................. 71FABRICATION AND MANUFACTURING ASPECTS OF FUTURE LOW-POWER ELECTRONIC DEVICES ........................... 78ULTRAFAST PROBES ................................................................................................................................................. 82SYNCHROTRON-RADIATION CHARACTERIZATION OF LOW-POWER ELECTRONIC MATERIALS AND DEVICES .......... 85ADVANCES IN TRANSMISSION ELECTRON MICROSCOPY APPLICABLE TO LOW-POWER DEVICES ............................ 88CONCLUDING REMARKS ........................................................................................................................... 91