An as-deposited As2S3 thin film is employed as a negative working inorganic resist in lithographic applications. A CF4 plasma is used to etch differentially for pattern delineation. A maximum etch rate ratio of 1.8 between the unexposed and exposed films is obtained. Ag-photodoped As2S3 is found to have a much slower etch rate in the CF4 plasma. Grating patterns have been obtained using this dry process. The extension of this concept to conventional organic polymer resists is considered.