This paper describes a tensile testing technique that is applicable to the study of the mechanical properties of thin films. The approach has two main components: fabrication of silicon-framed tensile specimens; and testing these specimens in the microtensile testing apparatus. Speckle interferometry is used to obtain accurate displacements needed for measurement of Young’s modulus. Typical results for electron-beam-evaporated films of copper and aluminum are compared to bulk values and to indentation results for thin films.