A review of lead-free solders for electronics applications

descriptionPublicationkeyboard_double_arrow_right Article 01 Aug 2017 English Publisher:Elsevier BVJournal:Microelectronics Reliability, volume 75, pages 77-95 (issn: 0026-2714,

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Authors: Shunfeng Cheng; Chien-Ming Huang 0004; Michael G. Pecht;

doi: 10.1016/j.microrel.2017.06.016

A review of lead-free solders for electronics applications

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Abstract

Abstract Ever since RoHS was implemented in 2006, Sn3.0Ag0.5Cu (SAC305) has been the primary lead-free solder for attaching electronic devices to printed circuit boards (PCBs). However, due to the 3.0 wt% Silver (Ag) in SAC305, companies have been looking at less expensive solder alternatives, especially for use in inexpensive products that have short operating lives and are used in mild application conditions. This paper reviews new lead-free solder alternatives and the trends in the industry, including SnCu-based solders, SnAgCu solders with Ag content

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