Packaging influences on the reliability of MEMS resonators

descriptionPublicationkeyboard_double_arrow_right Article 01 Aug 2008 English Publisher:Elsevier BVJournal:Microelectronics Reliability, volume 48, pages 1,567-1,571 (issn: 0026-2714,

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Authors: Jeroen J. M. Zaal; W. D. van Driel; S. Bendida; Q. Li; J. T. M. van Beek; G. Q. Zhang;

doi: 10.1016/j.microrel.2008.06.041

Packaging influences on the reliability of MEMS resonators

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Abstract

In this paper, the effect of assembly processes on the reliability of MEMS resonators is investigated. The common functions of MEMS resonators in the current technology are described as well as the most common designs. Virtual prototyping of a resonator during several assembly steps is used to estimate their influence. Experiments are executed in order to verify the simulation results. These experiments are also used to find yet unknown failure modes.

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